AG materials Inc.

A Material Design Company

Home

About AG materials

Products

Aluminum Nitride

Titanium Hydride

Sialon

Contact Us

Aluminum Nitride Powders
 
Aluminum Nitride (AlN) is a ceramic material with desirable properties such as high thermal conductivity, high electrical resistivity and high hardness. Thus, this material is well suited for usage in substrates, electronic packaging, thermal fillers, crucibles, firing tiles, and refractories. Various grades of AlN powders can be used for these as well as many other applications.
 

CHARACTERISTICS:

  • High thermal conductivity
  • High chemical purity
  • High dielectric strength
  • Thermal shock resistant
  • Corrosion resistant
  • Suitable for hot pressing, sintering or as thermal filler

APPLICATIONS:

  • Thermally conductive filler
  • Furnace tools and components
  • Corrosion resistant parts
  • Molten metal crucibles and liners
  • Heat radiation plates
  • Insulators
  • Metal matrix composites
  • Refractory coatings
  • RF/Microwave components
  • IC packages and substrates

 

 

AlN Powder

AlN Powder

AlN Powder

AlN Powder

TYPE

ANP-001B

ANP-001B5Y

ANP-010F

ANP-100F

PHYSICAL FEATURES

Appearance

Gray powder

Gray powder

Gray powder

Gray powder

Particle size D50

1~2 um

1~2 um

10~15 um

-100/+200 Mesh

Particle size D90

3~4 um

3~4 um

20~40 um

Specific surface

2.5 ~ 3.0 m2/g

 

 

 

Molecular weight (g/mol)

40.99

40.99

40.99

40.99

Density

3.26 g/cm3

3.26 g/cm3

3.26 g/cm3

3.26 g/cm3

TYPICAL COMPOSITION

Purity (%)

> 99.0

94.1 ~ 95.0

> 99.1

> 99.1

Y2O3 (wt%)

0.0

~ 5.0

0.0

0.0

Nitrogen (wt%)

33.5 - 33.8

31.8 - 32.1

33.5 - 33.9

33.5 - 33.9

Oxygen (wt%)

< 1.0

1.5 - 2.0

0.5 - 0.8

0.5 - 0.8

Carbon (wt%)

< 0.02

< 0.02

< 0.02

< 0.02

Silicon (wt%)

< 0.07

< 0.07

< 0.07

< 0.07

Metal Fe (wt%)

< 0.1

< 0.1

< 0.1

< 0.1

Metal Mg (wt%)

< 0.01

< 0.01

< 0.01

< 0.01

Metal Y (wt%)

< 0.01

3.8 - 4.1

< 0.01

< 0.01